Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments
  • Fluke RSE300 60 Hz Calibration Instruments

Fluke RSE300 60 Hz

FL13615202FR

60 Hz, 320 x 240, 1.85 mRad Mounted Infrared Camera for Research, Science and Engineering (RSE)

$6,201
Quantity

Description

The Fluke RSE300 60 Hz, 320 x 240, 1.85 mRad Mounted Infrared Camera for Research, Science and Engineering (RSE) is a fully-radiometric, stationary infrared camera. Building on 65 years of manufacturing the world's top measurement tools, these cameras offer powerful analytical capabilities through SmartView desktop software and plug-ins to MATLAB and LabVIEW. Users can now stream and analyze infrared data from their workstations with more confidence and faster results with both ruggedness and ease-of-use.

Designed for research, science and engineering, the RSE300 60 Hz offers the image quality and data analysis capabilities to enhance quality assurance, testing and product development functions.

IR-Fusion Technology: Precisely Blended Images Offer More Detail

Infrared images alone can be difficult to understand, which is why Fluke pioneered IR-Fusion technology. Automatically capture a visible image with every infrared image; this allows you to always know exactly what you are looking at. And image quality is everything when it comes to quickly analyzing infrared images - you need the right level of detail to pinpoint specific areas of concern. IR-Fusion blends visible light and infrared images to capture a clear 5MP real-world picture of your target. Blend at different preset levels and add picture-in-picture (PIP) to capture an incredibly revealing hybrid image.

   Powerful, modular suite of software tools for viewing, annotating, editing and analyzing infrared images
   Generate fully customizable and professional-looking reports in a few easy steps
   Full support of IR-Fusion Technology lets you edit images in five viewing modes
   Easy to use, yet delivers high-end analysis performance

Image Viewing and Editing

   Display array of open images for convenient selection and analysis
   Scroll across images to display temperature at any given point
   Edit color palettes, reference images, markers and emissivity

Extensive Annotation Possibilities

   Organize data with extensive annotations
   Add annotations (text comments) to images and reports
   Input information such as locations, category and other notes
   Referenced images can be linked for good/bad and before/after analysis

Detailed Analysis and Total Image Control

   Alter level, span and palette selection to enhance contrast or display detail more effectively
   Unlimited standard and user-defined analysis markers
  Five viewing modes allows you to choose best images

Simplified Report Generation

   Generate professional, customized reports fast
  One-click standardized report generation for quick results
  Choice of features including before/after, IR plus visible light, annotations, supporting data, graphics and charts
  Report wizard guides user through report generation


Fluke Connect: See it. Save it. Share it. All the facts, Right in the Field

Fluke Connect with ShareLive video call lets you stay in contact with your entire team without leaving the field. The Fluke Connect mobile app is available for Android and iOS and works with over 20 different Fluke products. Make the best decisions faster than ever before by viewing all temperature, mechanical, electrical and vibration measurements for each equipment asset in one place. Get started saving time and money by increasing your productivity.

Top Six IR Imager Application Types:

  • Electronics research and development
    • Finding localized overtemperature issues
    • Characterizing the thermal performance of components, conductors and semi-conductor substrates
    • Establishing appropriate cycle times
    • Analyzing assembly impact
    • Validating thermal modeling projections
    • Assessing collateral damage due to proximate sources of heat
  • Materials engineering
    • Phase change analysis
    • Residual or repeated thermal stress analysis
    • Non-destructive testing including inspection and analysis of delamination, voids, moisture inclusion, and stress fracturing of composite materials
    • Surface radiance analysis
  • Chemistry and biological sciences
    • Monitoring exothermic and endothermic chemical reactions
    • Analyzing biological processes
    • Environmental impact monitoring and analysis
    • Plant and vegetation research
  • Product design and validation
    • Characterization of product thermal performance
    • Characterization of material properties in a product
    • High-speed monitoring and analysis of product thermal performance
  • Geothermal, geological, and earth sciences
    • Monitoring and analysis of geothermal formations and processes
    • Volcanic research
  • Aerodynamics and aeronautics
    • Characterization and analysis of laminar flow
    • NDT of composite materials and structures
    • Stress and deformation analysis
    • Propulsion system performance analysis

Examples of Adding Value with Infrared Inspection:

  • Analyzing printed circuit boards:
    • Find localized over-temperature issues.
      Design engineers have to combine heat intensive solid-state high power transformers, high speed microprocessors, and Analog to Digital (A/D) or Digital to Analog (D/A) signal convertors into a very small package.
    • Establishing cycle times.
      Set the infrared camera to record thermal measurements as a solder point cools, so that you can set cycle times for automated systems. You can annotate key points with voice and text for quick review.
    • Analyzing assembly impact.
      Perform quality review at various stages of the development and manufacturing processes to ensure that any issues are captured early to avoid costly component failures down the road.
    • Validating thermal modeling.
      Using thermal modeling software provides a good estimate of what will occur when you populate a board, but it's still only a simulation. You can easily validate those results by comparing your thermal CAD model to what you're actually getting with the camera as you populate the board and power up components. Then you can scan the finished powered-up prototype and compare the results to your model to see how close it is.
    • Assessing collateral damage.
      Sometimes heat from the circuit board can affect the performance of other components in the system, such as making an LCD run too hot or interfering with mechanical operation. To avoid that you can assess how much heat dissipates from the entire package and how that heat may affect other parts of the system. Start by capturing an image of the powered up unit with the cover on. That image shows the temperatures of all the components under power. Then remove the cover and do a radiometric video recording of the temperature decay curve. You can then export a group of maximum temperature points into spreadsheet software and backwards extrapolate the resulting curve to time zero, to see what the temperature of the component was before you took the cover off.
  • Materials engineering:
    • Phase change analysis.
      Changing the phase of a product - from solid to liquid, often takes a great deal of heat, while changing from liquid to solid results in releasing an excessive amount of latent heat. If that extra heat has not been accounted for in the phase change process, it can result in warped parts. That is caused by the material staying liquid for longer than expected while heat is still evolving from the part, causing it to warp. Tracking the phase change process with a infrared camera will give you a precise picture of how long that phase change will take and you can adjust the heat application accordingly.
    • Residual thermal stress can either strengthen a product or can result in warping or breakage due to a problem with the materials or the heating and cooling process. Using a camera to analyze the actual production process compared to the thermal model can help identify variances that may impact product quality.
    • Non-destructive composite component testing.
      Scanning composite components with a high resolution infrared camera can reveal hidden defects such as cracks, voids, delamination, and disbonding.
    • Radiant analysis.
      The extremely high thermal sensitivity and unprecedented spatial resolution of Fluke infrared cameras allow for more thorough and accurate radiant analysis not previously possible with most commercially- available products.
Product Details
FL13615202FR
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